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Tin Solder Paste

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Leaded Solder Paste Sn63 Pb37 183℃ Melting Point 35g Tin Solder Scream With Syringe And Needle

Composition: Sn=63%, Pb=37% Leaded Solder Paste Melting Point: 183℃ Microns: 20~38um Net Weight: 35g/Syringe (Tube) Gross Weight:45g Suitable for soldering of fine-pitch ICs and various high-demand circuit boards

Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle

Composition: Sn=62.8%, Pb=36.8%, Ag=0.4% Leaded Solder Paste, silver-containing Melting Point: 181℃ Microns: 20~38um Net Weight: 35g/Syringe (Tube) Gross Weight:45g Suitable for high-temperature resistant double-sided fiber glass PCBs and SMT reflow

Solder Paste Sn99 Ag0.3 Cu0.7 Lead-Free 227 ℃ Melting Point 35g Tin Solder Scream With Syringe

Composition: Sn=99%, Ag=0.3%, Cu=0.7% Lead-free, Pb-free, silver-containing Melting Point: 227℃ Microns: 20~38um Net Weight: 35g/Syringe (Tube) Gross Weight:45g Suitable for high-temperature resistant double-sided fiber glass PCBs and SMT reflow so

Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe

Composition: Sn=96.5%, Ag=3.0%, Cu=0.5% Lead-free, Pb-free, silver-containing Melting Point: 217℃ Microns: 20~38um Net Weight: 35g/Syringe (Tube) Gross Weight:45g Suitable for soldering of fine-pitch ICs and various high-demand circuit boards

Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe

Composition: Sn=64.7%, Ag=0.3%, Bi=35% Lead-free, Pb-free, silver-containing Melting Point: 151℃ Microns: 20~38um Net Weight: 35g/Syringe (Tube) Gross Weight:45g Suitable for the special soldering of heat-sensitive PCB boards and small components

35g Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow

Composition: Sn=42%, Bi=58% Lead-free, Pb-free Melting Point: 138℃ Microns: 20~38um Suitable for the special soldering of heat-sensitive PCB boards and small components Net Weight: 35g/Syringe (Tube) Gross Weight:45g

MECHANIC XGSP-500 500g Tin Solder Paste Welding Paste 183°C Tinning Paste For BGA SMD SMT Soldering

Brand: MECHANIC Tin Paste Leaded Solder Paste Model: XGSP-500 Weight: 500g Low Temperature 183°C Tin Solder Paste Alloy: Sn63/Pb37

MECHANIC XGSP-200 200g Tin Solder Paste Welding Paste 183°C Tinning Paste For BGA SMD SMT Soldering

Brand: MECHANIC Tin Paste Leaded Solder Paste Model: XGSP-200 Weight: 200g Low Temperature 183°C Tin Solder Paste Alloy: Sn63/Pb37

MECHANIC XGZ-40 35g Tin Solder Paste Welding Paste 183°C Tinning Paste For BGA SMD SMT Soldering

Brand: MECHANIC Tin Paste Leaded Solder Paste Model: XGZ-40 Weight: 35g Low Temperature 183°C Tin Solder Paste Alloy: Sn63/Pb37

MECHANIC XGSP-80 60g Tin Solder Paste Welding Paste 183°C Tinning Paste For BGA SMD SMT Soldering

Brand: MECHANIC Tin Paste Leaded Solder Paste Model: XGSP-80 Weight: 60g Low Temperature 183°C Tin Solder Paste Alloy: Sn63/Pb37

MECHANIC XGSP-50 42g Welding Paste BGA SMD SMT Solder Paste 183°C Tinning Paste Tin Solder Paste For Phone Repair IC CPU GPU Soldering

Brand: MECHANIC Tin Paste Leaded Solder Paste Model: XGSP-50 Weight: 42g Low Temperature 183°C Tin Solder Paste Alloy: Sn63/Pb37

MECHANIC XGSP-40 35g BGA SMD SMT Solder Paste 183°C Tinning Paste Tin Solder Paste For Phone Repair IC CPU GPU Soldering

Brand: MECHANIC Tin Paste Leaded Solder Paste Model: XGSP-40 Weight: 35g Low Temperature 183°C Tin Solder Paste Alloy: Sn63/Pb37