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Tin Solder Paste
> Repair Tools & Accessories > Tin Solder Paste
Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
  • Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
  • Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
  • Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
  • Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
  • Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle

Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle

Item No.: 35G-181Sn62.8Pb36.8Ag0.4
Composition: Sn=62.8%, Pb=36.8%, Ag=0.4%
Leaded Solder Paste, silver-containing
Melting Point: 181℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for high-temperature resistant double-sided fiber glass PCBs and SMT reflow
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Description

Leaded Solder Paste Sn62.8 Pb36.8 Ag 0.4 181℃ Melting Point 35g Tin Solder Scream With Syringe And Needle- Low Residue Solder Cream for BGA and PCB Reflow

 

Composition: Sn=62.8%, Pb=36.8%, Ag=0.4%
Leaded Solder Paste, silver-containing
Melting Point: 181℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g

Features: 
High versatility
High electrical conductivity
Strong soldering joint
Bright solder joints


Applications:
Suitable for soldering of fine-pitch ICs, BGA solder ball planting in mobile phone repair, and soldering of various high-demand circuit boards











 •   Rotate counterclockwise to remove the syringe cap.

 •    Rotate clockwise to attach the needle.


 •   Smooth extrusion
 •   Fine texture
 •   Produced with professional formula
 •   Vacuum automatic mixing





 

 

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