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Leaded Solder Paste Sn63 Pb37 183℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
  • Leaded Solder Paste Sn63 Pb37 183℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
  • Leaded Solder Paste Sn63 Pb37 183℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
  • Leaded Solder Paste Sn63 Pb37 183℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
  • Leaded Solder Paste Sn63 Pb37 183℃ Melting Point 35g Tin Solder Scream With Syringe And Needle
  • Leaded Solder Paste Sn63 Pb37 183℃ Melting Point 35g Tin Solder Scream With Syringe And Needle

Leaded Solder Paste Sn63 Pb37 183℃ Melting Point 35g Tin Solder Scream With Syringe And Needle

Item No.: 35G-183Sn63Pb37
Composition: Sn=63%, Pb=37%
Leaded Solder Paste
Melting Point: 183℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards
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Leaded Solder Paste Sn63 Pb37 183℃ Melting Point 35g Tin Solder Scream With Syringe And Needle- Low Residue Solder Cream for BGA and PCB Reflow

 

Composition: Sn=63%, Pb=37%
Leaded Solder Paste
Melting Point: 183℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g

Features: 
High versatility
High electrical conductivity
Strong soldering joint
Bright solder joints



Applications:
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards











 •   Rotate counterclockwise to remove the syringe cap.

 •    Rotate clockwise to attach the needle.


 •   Smooth extrusion
 •   Fine texture
 •   Produced with professional formula
 •   Vacuum automatic mixing





 

 

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