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Tin Solder Paste
> Repair Tools & Accessories > Tin Solder Paste
Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe

Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe

Item No.: 35G-217Sn96.5 Ag3.0 Cu0.5
Composition: Sn=96.5%, Ag=3.0%, Cu=0.5%
Lead-free,  Pb-free, silver-containing
Melting Point: 217℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards
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Description

Solder Paste Sn96.5 Ag3.0 Cu0.5 Lead-Free 217 ℃ Melting Point 35g Tin Solder Scream With Syringe  - Low Residue Solder Cream for BGA and PCB Reflow

 

Composition: Sn=96.5%, Ag=3.0%, Cu=0.5%
Lead-free,  Pb-free, silver-containing
Melting Point: 217℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g

Features: 
Strong soldering joint
High electrical conductivity
Strong oxidation resistance


Applications:
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards











 •   Rotate counterclockwise to remove the syringe cap.

 •    Rotate clockwise to attach the needle.


 •   Smooth extrusion
 •   Fine texture
 •   Produced with professional formula
 •   Vacuum automatic mixing





 

 

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