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Tin Solder Paste
> Repair Tools & Accessories > Tin Solder Paste
35g Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow
  • 35g Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow
  • 35g Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow
  • 35g Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow
  • 35g Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow
  • 35g Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow

35g Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow

Item No.: 35G-138Sn42Bi58
Composition: Sn=42%, Bi=58%
Lead-free,  Pb-free
Melting Point: 138℃
Microns: 20~38um
Suitable for the special soldering of
heat-sensitive PCB boards and small components
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
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Description

Lead-Free Solder Paste For Electronics 138 ℃ Melting Point Sn42 Bi58 with Syringe - Low Residue Solder Cream for BGA and PCB Reflow

 

Item Number :35G-138Sn42Bi58 
Composition: Sn=42%, Bi=58%
Lead-free,  Pb-free 
Melting Point: 138℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g

 

Features: 
Lead-free process
Low temperature requirement
Easy to operate

 

Applications
Suitable for the special soldering of
heat-sensitive PCB boards and small components











 •   Rotate counterclockwise to remove the syringe cap.

 •    Rotate clockwise to attach the needle.


 •   Smooth extrusion
 •   Fine texture
 •   Produced with professional formula
 •   Vacuum automatic mixing





 

 

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