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Tin Solder Paste
> Repair Tools & Accessories > Tin Solder Paste
Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe

Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe

Item No.: 35G-151Sn64.7Ag0.3Bi35
Composition: Sn=64.7%, Ag=0.3%, Bi=35%
Lead-free,  Pb-free, silver-containing
Melting Point: 151℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for the special soldering of
heat-sensitive PCB boards and small components
INQUIRY
Description

Solder Paste Sn64.7 Ag0.3 Bi35 Lead-Free 151 ℃ Melting Point 35g Tin Solder Scream With Syringe  - Low Residue Solder Cream for BGA and PCB Reflow

 

Composition: Sn=64.7%, Ag=0.3%, Bi=35%
Lead-free,  Pb-free, silver-containing
Melting Point: 151℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g

Features: 
Lead-free silver-containing
High versatility
High electrical conductivity
Strong soldering joint


Applications
Suitable for the special soldering of
heat-sensitive PCB boards and small components











 •   Rotate counterclockwise to remove the syringe cap.

 •    Rotate clockwise to attach the needle.


 •   Smooth extrusion
 •   Fine texture
 •   Produced with professional formula
 •   Vacuum automatic mixing





 

 

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