Contact Us
0086 18665889453
No. 117 Guanlan Road, Longhua district ,Shenzhen, China
Solder Paste Sn99 Ag0.3 Cu0.7 Lead-Free 227 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn99 Ag0.3 Cu0.7 Lead-Free 227 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn99 Ag0.3 Cu0.7 Lead-Free 227 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn99 Ag0.3 Cu0.7 Lead-Free 227 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn99 Ag0.3 Cu0.7 Lead-Free 227 ℃ Melting Point 35g Tin Solder Scream With Syringe
  • Solder Paste Sn99 Ag0.3 Cu0.7 Lead-Free 227 ℃ Melting Point 35g Tin Solder Scream With Syringe

Solder Paste Sn99 Ag0.3 Cu0.7 Lead-Free 227 ℃ Melting Point 35g Tin Solder Scream With Syringe

Item No.: 35G-227Sn99Ag0.3Cu0.7
Composition: Sn=99%, Ag=0.3%, Cu=0.7%
Lead-free,  Pb-free, silver-containing
Melting Point: 227℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g
Suitable for high-temperature resistant double-sided fiber glass PCBs and SMT reflow so
INQUIRY

Solder Paste Sn99 Ag0.3 Cu0.7 Lead-Free 227 ℃ Melting Point 35g Tin Solder Scream With Syringe- Low Residue Solder Cream for BGA and PCB Reflow

 

Composition: Sn=99%, Ag=0.3%, Cu=0.7%
Lead-free,  Pb-free, silver-containing
Melting Point: 227℃
Microns: 20~38um
Net Weight: 35g/Syringe (Tube)
Gross Weight:45g

Features: 
Strong soldering joint
High electrical conductivity
Strong oxidation resistance



Applications:
Suitable for soldering of fine-pitch ICs and various high-demand circuit boards
Suitable for soldering of high-temperature resistant double-sided fiber glass PCBs and SMT (Surface Mount Technology) reflow soldering











 •   Rotate counterclockwise to remove the syringe cap.

 •    Rotate clockwise to attach the needle.


 •   Smooth extrusion
 •   Fine texture
 •   Produced with professional formula
 •   Vacuum automatic mixing





 

 

Review