High Copy 30cc AMTECH RMA-223 Solder Flux Welding Grease Solder Paste for Phone CPU Reballing Low Residue No Cleaning Welding Flux Repair Tools

Item No.: 30CC-223-C

Model:RMA-223
Quality Level: Common
Volume: 30cc
G.W.:40g
Images are for reference only.
We will deliver products marked with the latest production date when shipping.

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High Copy 30cc AMTECH RMA-223 Solder Flux Welding Grease Solder Paste for Phone CPU Reballing Low Residue No Cleaning Welding Flux Repair Tools

Model:RMA-223
Quality Level: Common
Net Weight: 100g
Gross Weight :110g

Images are for reference only. We will deliver products marked with the latest production date when shipping.

1. RMA-223 is a moderately active rosin type soldering paste, which is widely used in SMD repair process of mobile phone boards.

2. It is a wash-free soldering paste with very light color and very high SIR value. It is recommended to be used for BGA, CSP and other ball matrix solder joint repair and ball repair.

High Copy 30cc AMTECH RMA-223 Solder Flux Welding Grease Solder Paste for Phone CPU Reballing Low Residue No Cleaning Welding Flux Repair Tools

High Copy 30cc AMTECH RMA-223 Solder Flux Welding Grease Solder Paste for Phone CPU Reballing Low Residue No Cleaning Welding Flux Repair Tools

Model:RMA-223
Quality Level: Common
Net Weight: 100g
Gross Weight :110g

1. RMA-223 is a moderately active rosin type soldering paste, which is widely used in SMD repair process of mobile phone boards.

2. It is a wash-free soldering paste with very light color and very high SIR value. It is recommended to be used for BGA, CSP and other ball matrix solder joint repair and ball repair.

3. Each one includes a booster needle

4. Good insulation and smooth welding surface; No deterioration, no drying

5. Good immersion and high-strength joint, non-toxic and non-corrosive;

High Copy 30cc AMTECH RMA-223 Solder Flux Welding Grease Solder Paste for Phone CPU Reballing Low Residue No Cleaning Welding Flux Repair Tools

High Copy 30cc AMTECH RMA-223 Solder Flux Welding Grease Solder Paste for Phone CPU Reballing Low Residue No Cleaning Welding Flux Repair Tools

Model:RMA-223 Quality Level: Common Net Weight: 100g Gross Weight :110g

1. RMA-223 is a moderately active rosin type soldering paste, which is widely used in SMD repair process of mobile phone boards.

2. It is a wash-free soldering paste with very light color and very high SIR value. It is recommended to be used for BGA, CSP and other ball matrix solder joint repair and ball repair.

3. Each one includes a booster needle

4. Good insulation and smooth welding surface; No deterioration, no drying

5. Good immersion and high-strength joint, non-toxic and non-corrosive;

Model:RMA-223
Quality Level: Common
Net Weight: 100g
Gross Weight :110g